HALT/HASS Testing Guidance
MIL-STD-810 Testing Guideline
MIL-STD-810 standard contains test methods and planning for engineering direction for considering the influences that environmental stresses have on material, products or equipment through every phase of their service life. Used by the U.S. military to test product limits and capabilities that the product will experience throughout its life, MIL-STD-810 testing is also used as a standard for rugged commercial products.
Maximising Battery Life Checklist
What is Industry 4.0 in terms of Manufacturing, the innovations and trends
By its nature, an Industry 4.0 implementation will be incremental, not big bang. Manufacturing will still need people and centralized information applications in addition to the new IIoT data for the next several decades. That’s where the systems that manage all that data, and the people, processes, products and machines that generate it – manufacturing operations management (MOM), or the next evolution of manufacturing execution systems (MES) – will play a critical role.
Optimize Thermal Performance of Power Adapters with Simcenter Flotherm
In the case of the power adapters that NXP Semiconductors’ Smart Power Division are developing thermal considerations have really come to the fore, driven by the trends we see in mobile power adaptors, which are getting smaller and have a higher output power. Thermal limits are now constraining all aspects of the design.
The Importance of Junction Temperature in Electronics Components Thermal Reliability
John Wilson, technical marketing engineer at Mentor, a Siemens Business, explains how junction temperatures have a direct correlation to product reliability and performance. Using tools such as Simcenter™ T3STER™ and Simcenter™ Flotherm™ enable users to tackle the challenge of designing for reliability without the need for prototyping.
Simcenter Flotherm - accurate simulations for electronics thermal design
Simcenter Flotherm - The goal of electronics thermal design is to accurately predict component junction temperatures to ensure that they are within specification. CFD allowed designers to predict the flow of cooling air, and include 3D thermal simulations of the board and components, increasing the need for more accurate component level modeling.
